Hu Cheng
Postdoctoral Fellow at The Hong Kong Polytechnic University
I am currently a Postdoctoral Fellow at The Hong Kong Polytechnic University (PolyU), working with Prof. Bo Yang and Prof. Ajay Kumar. Prior to this, I was a Postdoctoral Fellow at the InnoHK Centre for Transformative Garment Production (TransGP) and a Visiting Research Associate at The University of Hong Kong (HKU), where I worked with Prof. Kazuhiro Kosuge. I received my Ph.D. degree from The Chinese University of Hong Kong (CUHK) in July 2023, under the supervision of Prof. Max Q.-H. Meng.
hcheng@link.cuhk.edu.hk
(852) 5165-0185
Room U401, 4/F, Core U, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong.
Research Interests
Robot grasping, deformable object manipulation, robot vision, 6-DoF pose estimation, deep learning and pattern recognition.
Research Demos
Education
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The Chinese University of Hong KongPh.D. in Electronic Engineering, Department of Electronic Engineering2016.08 – 2023.07
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University of California San DiegoVisiting Scholar, College of Computer Science and Engineering2019.06 – 2020.03
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Northeastern UniversityB.E. in Automation, College of Information Science and Engineering2012.09 – 2016.06
Work Experience
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The Hong Kong Polytechnic UniversityPostdoctoral Fellow · Hong Kong2025.05 – present
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Centre for Transformative Garment Production@InnoHKPostdoctoral Fellow · Hong Kong2023.09 – 2025.05
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The University of Hong KongVisiting Research Associate · Hong Kong2023.09 – 2025.05
Journal Publications
* equal contribution · † corresponding author
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IEEE Transactions on Automation Science and Engineering (T-ASE), 2026 JCR Q1 · IF 5.6
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IEEE Internet of Things Journal (IoT), 2026 JCR Q1 · IF 8.9
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IEEE Internet of Things Journal (IoT), 2025 JCR Q1 · IF 8.9
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Science China Information Sciences (SCIS), 2025 JCR Q1 · IF 7.3
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IEEE Transactions on Automation Science and Engineering (T-ASE), 2024 JCR Q1 · IF 5.6
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IEEE Transactions on Automation Science and Engineering (T-ASE), 2023 JCR Q1 · IF 5.6
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IEEE Sensors Journal, 2023 JCR Q1 · IF 4.3
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IEEE Transactions on Instrumentation and Measurement (TIM), 2022 JCR Q1 · IF 5.6
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IEEE Sensors Journal, 2022 JCR Q1 · IF 4.3
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IEEE Transactions on Instrumentation and Measurement (TIM), 2022 JCR Q1 · IF 5.6
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IEEE Transactions on Automation Science and Engineering (T-ASE), 2022 JCR Q1 · IF 5.6
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IEEE Transactions on Instrumentation and Measurement (TIM), 2021 JCR Q1 · IF 5.6
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IEEE Sensors Journal, 2021 JCR Q1 · IF 4.3
Conference Publications
* equal contribution
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IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), 2026 CCF-A
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IEEE International Conference on Robotics and Automation (ICRA), 2022 CCF-B
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IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), 2021 CCF-C
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IEEE International Conference on Robotics and Automation (ICRA), 2020 CCF-B
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IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), 2020 CCF-C
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IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), 2020 CCF-C
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IEEE International Conference on Advanced Robotics and Mechatronics (ICARM), 2023
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IEEE International Conference on Robotics and Biomimetics (ROBIO), 2020
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IEEE International Conference on Robotics and Biomimetics (ROBIO), 2018★ T. J. Tarn Best Paper in Robotics Finalist
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IEEE International Conference on Robotics and Biomimetics (ROBIO), 2018
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IEEE International Conference on Robotics and Biomimetics (ROBIO), 2018
Projects
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Intelligent Robot System for Automated Deployment of Airport Passenger TrolleysHK Innovation and Technology Commission, ITS/105/18FPKey Participant
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Magnetically Actuated Active Capsule Robot System for ColonoscopyNational Key R&D Program of China, 2019YFB1312400Key Participant
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Robotic Wireless Capsule Endoscopy for Automated GI Disease DiagnosisHK RGC Collaborative Research Fund, C4063-18GKey Participant
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Vision-Guided Autonomous Robotic SurgeryHK RGC Theme-based Research Scheme, T42-409/18-RParticipant
Awards & Honors
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Talent Development ScholarshipHong Kong Government2021
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Hong Kong, China – APEC ScholarshipHong Kong Education Bureau2021
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Reaching Out AwardHong Kong Government2020
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Second Award & Golden Egg Award, JD Robot ChallengeJD Ltd, Tianjin, China2018
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Outstanding Student AwardThe Chinese University of Hong Kong2017
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National Encouragement ScholarshipMinistry of Education, China2015
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Outstanding Student of NEUNortheastern University2013, 2014
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National ScholarshipMinistry of Education, China2013, 2014
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First Prize ScholarshipNortheastern University2012, 2013, 2014
Competitions
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Finalist, DJI RoboMaster Manipulation Challenge (ICRA)Ranked top 5/932017
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Second Award, JD Robot ChallengeRanked top 2/3002018
Professional Activities & Services
Journal Reviewer
Pattern Recognition (PR)
IEEE/ASME Transactions on Mechatronics (TMECH)
IEEE Transactions on Industrial Informatics (TII)
Science China Information Sciences (SCIS)
IEEE Transactions on Automation Science and Engineering (TASE)
IEEE Transactions on Instrumentation and Measurement (TIM)
IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I)
Robotics and Autonomous Systems (RAS)
Expert Systems With Applications
IEEE Sensors Journal
IEEE Access
IEEE Robotics and Automation Letters (RA-L)
Conference Reviewer
ICRA
IROS
CASE
ICARM
ROBIO
ECCV
Session Chair
ICRA
ICAR
ICIA
Teaching Experience
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Teaching Assistant, CUHKTutorial on ENGG 2420A: Complex Analysis and Differential Equations for Engineers2018 Fall
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Teaching Assistant, CUHKTutorial on BMEG3101: Medical Instrument and Design2016 Fall, 2017 Fall
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Teaching Assistant, CUHKTutorial on BMEG2011: Biomedical Engineering Laboratory2017 Spring
Professional Skills
Programming
Python · MATLAB · C · C++
Tools & Frameworks
TensorFlow · PyTorch · ROS · SolidWorks · PyBullet · Unreal Engine